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Electrodeposition of Gold to Conformally Fill High-Aspect-Ratio Nanometric Silicon Grating Trenches: A Comparison of Pulsed and Direct Current Protocols

Overview of attention for article published in Journal of Surface Engineered Materials and Advanced Technology, October 2015
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Title
Electrodeposition of Gold to Conformally Fill High-Aspect-Ratio Nanometric Silicon Grating Trenches: A Comparison of Pulsed and Direct Current Protocols
Published in
Journal of Surface Engineered Materials and Advanced Technology, October 2015
DOI 10.4236/jsemat.2015.54022
Pubmed ID
Authors

Sami A. Znati, Nicholas Chedid, Houxun Miao, Lei Chen, Eric E. Bennett, Han Wen

Abstract

Filling high-aspect-ratio trenches with gold is a frequent requirement in the fabrication of x-ray optics as well as micro-electronic components and other fabrication processes. Conformal electrodeposition of gold in sub-micron-width silicon trenches with an aspect ratio greater than 35 over a grating area of several square centimeters is challenging and has not been described in the literature previously. A comparison of pulsed plating and constant current plating led to a gold electroplating protocol that reliably filled trenches for such structures.

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Mendeley readers

The data shown below were compiled from readership statistics for 28 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 28 100%

Demographic breakdown

Readers by professional status Count As %
Student > Ph. D. Student 14 50%
Researcher 3 11%
Student > Doctoral Student 2 7%
Student > Bachelor 1 4%
Professor 1 4%
Other 3 11%
Unknown 4 14%
Readers by discipline Count As %
Materials Science 9 32%
Physics and Astronomy 5 18%
Engineering 5 18%
Energy 1 4%
Chemistry 1 4%
Other 1 4%
Unknown 6 21%