| Title |
Retraction Note: Solder Selection for Reflowing Large Ceramic Substrates During PCB Assembly
|
|---|---|
| Published in |
Journal of Failure Analysis and Prevention, September 2018
|
| DOI | 10.1007/s11668-018-0532-3 |
| Authors |
Prashant Reddy Gangidi, Noy Souriyasak |
Attention Score in Context
This research output has an Altmetric Attention Score of 9. This is our high-level measure of the quality and quantity of online attention that it has received. This Attention Score, as well as the ranking and number of research outputs shown below, was calculated when the research output was last mentioned on 14 September 2018.
All research outputs
#3,505,282
of 23,911,072 outputs
Outputs from Journal of Failure Analysis and Prevention
#3
of 100 outputs
Outputs of similar age
#70,534
of 338,708 outputs
Outputs of similar age from Journal of Failure Analysis and Prevention
#1
of 2 outputs
Altmetric has tracked 23,911,072 research outputs across all sources so far. Compared to these this one has done well and is in the 84th percentile: it's in the top 25% of all research outputs ever tracked by Altmetric.
So far Altmetric has tracked 100 research outputs from this source. They receive a mean Attention Score of 3.1. This one has done particularly well, scoring higher than 96% of its peers.
Older research outputs will score higher simply because they've had more time to accumulate mentions. To account for age we can compare this Altmetric Attention Score to the 338,708 tracked outputs that were published within six weeks on either side of this one in any source. This one has done well, scoring higher than 79% of its contemporaries.
We're also able to compare this research output to 2 others from the same source and published within six weeks on either side of this one. This one has scored higher than all of them