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Mendeley readers
Title |
Assembly and Reliability of Lead-Free Solder Joints
|
---|---|
Published by |
Springer Singapore, July 2020
|
DOI | 10.1007/978-981-15-3920-6 |
ISBNs |
978-9-81-153919-0, 978-9-81-153920-6
|
Authors |
Lau, John H., Lee, Ning-Cheng |
Mendeley readers
The data shown below were compiled from readership statistics for 26 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
Country | Count | As % |
---|---|---|
Unknown | 26 | 100% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Researcher | 5 | 19% |
Student > Ph. D. Student | 3 | 12% |
Lecturer | 2 | 8% |
Student > Master | 2 | 8% |
Student > Bachelor | 1 | 4% |
Other | 3 | 12% |
Unknown | 10 | 38% |
Readers by discipline | Count | As % |
---|---|---|
Materials Science | 6 | 23% |
Engineering | 6 | 23% |
Unspecified | 1 | 4% |
Chemistry | 1 | 4% |
Chemical Engineering | 1 | 4% |
Other | 0 | 0% |
Unknown | 11 | 42% |