Influence of Indium Addition on Whisker Mitigation in Electroplated Tin Coatings on Copper Substrates
Overview of attention for article published in Journal of Electronic Materials, November 2015
Altmetric Badge
About this Attention Score
-
Above-average Attention Score compared to outputs of the same age (55th percentile)
-
Average Attention Score compared to outputs of the same age and source
Readers on
- mendeley
- 14 Mendeley