You are seeing a free-to-access but limited selection of the activity Altmetric has collected about this research output.
Click here to find out more.
Timeline
Attention over time
Attention Score history
Mendeley demographics
| Title |
Preparation of Reversible Thermosets and their Application in Temporary Adhesive for Thin Wafer Handling
|
|---|---|
| Published by |
Institute of Electrical and Electronics Engineers (IEEE), May 2015
|
| DOI | 10.1109/ectc.2015.7159747 |
| Authors |
L. Deng, H. Fang, X. Shuai, G. Zhang, C. P. Wong, R. Sun |
Login to access the Attention Digest and the Sentiment Analysis related to this output.
Mendeley demographics
The data shown below were compiled from readership statistics for 10 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 10 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Master | 2 | 20% |
| Other | 1 | 10% |
| Student > Doctoral Student | 1 | 10% |
| Professor | 1 | 10% |
| Student > Ph. D. Student | 1 | 10% |
| Other | 1 | 10% |
| Unknown | 3 | 30% |
| Readers by discipline | Count | As % |
|---|---|---|
| Materials Science | 3 | 30% |
| Chemistry | 2 | 20% |
| Engineering | 1 | 10% |
| Unknown | 4 | 40% |