Resonant Clock Synchronization With Active Silicon Interposer for Multi-Die Systems

Overview of attention for article published in IEEE Transactions on Circuits and Systems I: Regular Papers, February 2021

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patent: 5 patents

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So far, Altmetric has seen 5 patents that reference this research output.

Die stacking for modular parallel processors

Grant US-12660682-B2

United States of America

16 Jun 2026

RESONANT ROTARY CLOCKING FOR SYNCHRONIZED CLOCK SIGNALS

Application EP-4454123-A4

European Patent Office

24 Dec 2025

Resonant rotary clocking for synchronized clock signals

Grant US-12489399-B2

United States of America

02 Dec 2025

Multi-layer laminated chip and clock control method thereof

Application CN-120315536-A

China

15 Jul 2025

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