Processing and Mechanical Properties of Ti3SiC2: I, Reaction Path and Microstructure Evolution

Overview of attention for article published in Journal of the American Ceramic Society, December 2004

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Semiconductor interconnect, electrode for semiconductor device, and method of preparing…

Grant US-12014985-B2

United States of America

Semiconductor interconnect, electrode for semiconductor device, and method of preparing…

Grant US-11728270-B2

United States of America

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