Heterogeneous System-Level Package Integration - Trends and Challenges

Overview of attention for article published in this source, June 2020

Altmetric Badge

Mentioned by

patent: 22 patents

Readers on

mendeley: 33 Mendeley

So far, Altmetric has seen 22 patents that reference this research output.

Method of forming ferroelectric chiplet in a multi-dimensional packaging with I/O switch…

Grant US-12717479-B2

United States of America

Ultra high-bandwidth artificial intelligence (AI) processor with DRAM under the processor

Grant US-12283571-B1

United States of America

Method of forming 3D stacked compute and memory with copper pillars

Grant US-12272675-B2

United States of America

Multi-die mapping matrix multiplication

Grant US-12265494-B1

United States of America

This page shows the most recent patents that mention this research output. Click here to find out how to access more activity, including 18 additional patents.