An intelligent system for wafer bin map defect diagnosis: An empirical study for semiconductor manufacturing

Overview of attention for article published in Engineering Applications of Artificial Intelligence, May 2013

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Method of deep learning-based examination of a semiconductor specimen and system thereof

Grant US-12183066-B2

United States of America

METHOD OF DEEP LEARINING-BASED EXAMINATION OF A SEMICONDUCTOR SPECIMEN AND SYSTEM THEREOF

Application US-20220067523-A1

United States of America

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