Failure Mode and Thermal Performance Analysis of Stacked Panel Level Package (PLP)

Overview of attention for article published in this source, January 2010

Altmetric Badge

Mentioned by

patent: 4 patents

Readers on

mendeley: 1 Mendeley

So far, Altmetric has seen 4 patents that reference this research output.

Chip temperature calculation method and chip temperature calculation device

Grant CN-109933488-B

China

CHIP TEMPERATURE COMPUTATION METHOD AND CHIP TEMPERATURE COMPUTATION DEVICE

N/A TW-I689724-B

Chinese Taipei

Chip temperature computation method and chip temperature computation device

Grant US-10540474-B2

United States of America

Chip temperature calculation method and chip temperature computing device

Application CN-109933488-A

China

This page shows the most recent patents that mention this research output. Click here to find out how to access more activity.