Sensitivity Improvement for CMOS-MEMS Capacitive Pressure Sensor Using Double Deformable Diaphragms with Trenches

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Method of forming a sealed cavity embedded in a semiconductor wafer

Grant US-12356698-B2

United States of America

MEMS (micro-electromechanical system) capacitor pressure chip, preparation method thereof…

Application CN-113340517-A

China

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