Effect of Interfacial Compound Formation on Contact Resistivity of Soldered Junctions Between Bismuth Telluride-Based Thermoelements and Copper

Overview of attention for article published in Electrochemical and Solid State Letters, January 2007

Altmetric Badge

Mentioned by

patent: 1 patent

Readers on

mendeley: 29 Mendeley

So far, Altmetric has seen 1 patent that references this research output.

Methods for thick film thermoelectric device fabrication

Application EP-2903043-A2

European Patent Office

This page shows the most recent patents that mention this research output. Click here to find out how to access more activity.