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Monolithic 3D Chip Integrated with 500ns NVM, 3ps Logic Circuits and SRAM

Overview of attention for article published in this source, December 2013
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2 patents

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60 Mendeley
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Article details
Title
Monolithic 3D Chip Integrated with 500ns NVM, 3ps Logic Circuits and SRAM
Published by
Institute of Electrical and Electronics Engineers (IEEE), December 2013
DOI 10.1109/iedm.2013.6724593
Authors

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Timeline Attention over time Attention Score history
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Mendeley demographics

Mendeley demographics

The data shown below were compiled from readership statistics for 60 Mendeley readers of this research output. Click here to see the associated Mendeley record.
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Geographical breakdown

Geographical breakdown
Country Count As %
France 1 2%
Belgium 1 2%
Unknown 58 97%

Demographic breakdown

Readers by professional status
Readers by professional status Count As %
Student > Ph. D. Student 25 42%
Researcher 16 27%
Student > Master 8 13%
Student > Doctoral Student 2 3%
Student > Bachelor 2 3%
Other 0 0%
Unknown 7 12%
Readers by discipline
Readers by discipline Count As %
Engineering 38 63%
Computer Science 4 7%
Physics and Astronomy 4 7%
Materials Science 4 7%
Nursing and Health Professions 1 2%
Other 1 2%
Unknown 8 13%