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Timeline
Attention over time
Attention Score history
Mendeley demographics
| Title |
TSV Process Using Bottom-up Cu Electroplating and its Reliability Test
|
|---|---|
| Published by |
Institute of Electrical and Electronics Engineers (IEEE), January 2008
|
| DOI | 10.1109/estc.2008.4684427 |
| Authors |
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Mendeley demographics
The data shown below were compiled from readership statistics for 14 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 14 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 4 | 29% |
| Professor | 2 | 14% |
| Student > Master | 2 | 14% |
| Researcher | 2 | 14% |
| Unspecified | 1 | 7% |
| Other | 2 | 14% |
| Unknown | 1 | 7% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 7 | 50% |
| Materials Science | 3 | 21% |
| Unspecified | 1 | 7% |
| Chemistry | 1 | 7% |
| Unknown | 2 | 14% |