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A Test Integration Methodology for 3D Integrated Circuits

Overview of attention for article published in this source, December 2010
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10 Mendeley
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Article details
Title
A Test Integration Methodology for 3D Integrated Circuits
Published by
Institute of Electrical and Electronics Engineers (IEEE), December 2010
DOI 10.1109/ats.2010.71
Authors

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Mendeley demographics

Mendeley demographics

The data shown below were compiled from readership statistics for 10 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Geographical breakdown
Country Count As %
Unknown 10 100%

Demographic breakdown

Readers by professional status
Readers by professional status Count As %
Student > Master 5 50%
Student > Ph. D. Student 4 40%
Professor > Associate Professor 1 10%
Readers by discipline
Readers by discipline Count As %
Engineering 6 60%
Computer Science 4 40%