Comparison of the benefits, from SiO2 to ultralow-K dielectric and air spacing introduction, in term of interconnects performances, for the future high speed Ic’s in a multicoupled lines system

Overview of attention for article published in this source, May 2008

Altmetric Badge

Mentioned by

Article details
Title	Comparison of the benefits, from S<sub>i</sub>O<sub>2</sub> to ultralow-K dielectric and air spacing introduction, in term of interconnects performances, for the future high speed Ic’s in a multicoupled lines system
Published by	Institute of Electrical and Electronics Engineers (IEEE), May 2008
DOI	10.1109/spi.2007.4512199
Authors	F. Ponchel, Jf. Legier, E. Paleczny, C. Seguinot, D. Deschacht

Timeline