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Effect of CU Line Capping Process on Stress Migration Reliability
Overview of attention for article published in this source, January 2006
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Patents
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2
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Semiconductor devices and contact plugs
Grant US-10741657-B2
United States of America
11 Aug 2020
Semiconductor devices and contact plugs
Grant US-10403729-B2
United States of America
03 Sep 2019
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