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| Title |
An evaluation of the HotOzone/sup TM/ process: a new post etch resist and residue removal process
|
|---|---|
| Published by |
Institute of Electrical and Electronics Engineers (IEEE), January 2000
|
| DOI | 10.1109/iitc.2000.854277 |
| Authors |
Shawming Ma, R. Parker, R. Kavari, I. Leal, D.G. Boyers, Cremer J.T. |
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