A Unified Method for Parametric Fault Characterization of Post-Bond TSVs

Overview of attention for article published in this source, November 2012

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So far, Altmetric has seen 9 patents that reference this research output.

Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels

Grant US-10444279-B2

United States of America

Scan-based test architecture for interconnects in stacked designs

Grant US-9720041-B2

United States of America

Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels

Grant US-9482720-B2

United States of America

Test device, semiconductor device and testing method thereof

Grant US-9459309-B2

United States of America

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