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Timeline
Attention over time
Attention Score history
Mendeley demographics
| Title |
On-Chip TSV Testing for 3D IC before Bonding Using Sense Amplification
|
|---|---|
| Published by |
Institute of Electrical and Electronics Engineers (IEEE), January 2009
|
| DOI | 10.1109/ats.2009.42 |
| Authors |
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Mendeley demographics
The data shown below were compiled from readership statistics for 28 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 28 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 12 | 43% |
| Student > Master | 8 | 29% |
| Student > Bachelor | 2 | 7% |
| Professor > Associate Professor | 2 | 7% |
| Lecturer > Senior Lecturer | 1 | 4% |
| Other | 1 | 4% |
| Unknown | 2 | 7% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 19 | 68% |
| Computer Science | 5 | 18% |
| Materials Science | 1 | 4% |
| Unknown | 3 | 11% |