On-Chip TSV Testing for 3D IC before Bonding Using Sense Amplification

Overview of attention for article published in this source, January 2009

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System and method for electrical testing of through silicon vias (TSVs)

Grant US-10775426-B2

United States of America

System for electrical testing of through silicon vias (TSVs)

Grant US-9966318-B1

United States of America

Device for electrically testing the interconnections of a microelectronic device

Grant US-9784786-B2

United States of America

Scan-based test architecture for interconnects in stacked designs

Grant US-9720041-B2

United States of America

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