A Virtual Metrology System for Predicting End-of-Line Electrical Properties using a MANCOVA Model with Tools Clustering

Overview of attention for article published in IEEE Transactions on Industrial Informatics, January 2011

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System for wafer quality predictive modeling based on multi-source information with…

Grant US-9395408-B2

United States of America

Method and system for wafer quality predictive modeling based on multi-source information…

Grant US-9176183-B2

United States of America

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