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Multi-Visit TAMs to Reduce the Post-Bond Test Length of 2.5D-SICs with a Passive Silicon Interposer Base
Overview of attention for article published in this source, November 2011
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3D chip testing through micro-C4 interface
Grant US-11193953-B2
United States of America
07 Dec 2021
3D chip testing through micro-C4 interface
Grant US-10371717-B2
United States of America
06 Aug 2019
3D chip testing through micro-C4 interface
Grant US-9726691-B2
United States of America
08 Aug 2017
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