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Bonding mechanism of electroless Ni-P film with AlN substrate and Cu foil

Overview of attention for article published in IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, June 1998
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About this Attention Score

  • Among the highest-scoring outputs from this source (#19 of 158)
  • Above-average Attention Score compared to outputs of the same age (61st percentile)
  • Average Attention Score compared to outputs of the same age and source

Mentioned by

patent
2 patents

Readers on

mendeley
7 Mendeley
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Article details
Title
Bonding mechanism of electroless Ni-P film with AlN substrate and Cu foil
Published in
IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, June 1998
DOI 10.1109/95.705482
Authors

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Timeline Attention over time Attention Score history
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Activity
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Mendeley demographics

Mendeley demographics

The data shown below were compiled from readership statistics for 7 Mendeley readers of this research output. Click here to see the associated Mendeley record.
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Geographical breakdown

Geographical breakdown
Country Count As %
Unknown 7 100%

Demographic breakdown

Readers by professional status
Readers by professional status Count As %
Student > Ph. D. Student 2 29%
Researcher 2 29%
Professor > Associate Professor 1 14%
Student > Doctoral Student 1 14%
Unknown 1 14%
Readers by discipline
Readers by discipline Count As %
Materials Science 5 71%
Chemical Engineering 1 14%
Unknown 1 14%
Attention Score in Context

Attention Score in Context

This research output has an Altmetric Attention Score of 6. This is our high-level measure of the quality and quantity of online attention that it has received. This Attention Score, as well as the ranking and number of research outputs shown below, was calculated when the research output was last mentioned on 27 October 2010.
All research outputs
#7,582,403
of 34,364,397 outputs
Outputs from IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A
#19
of 158 outputs
Outputs of similar age
#10,853
of 48,794 outputs
Outputs of similar age from IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A
#3
of 10 outputs
Altmetric has tracked 34,364,397 research outputs across all sources so far. This one has received more attention than most of these and is in the 73rd percentile.
So far Altmetric has tracked 158 research outputs from this source. They receive a mean Attention Score of 4.4. This one has gotten more attention than average, scoring higher than 68% of its peers.
Older research outputs will score higher simply because they've had more time to accumulate mentions. To account for age we can compare this Altmetric Attention Score to the 48,794 tracked outputs that were published within six weeks on either side of this one in any source. This one has gotten more attention than average, scoring higher than 61% of its contemporaries.
We're also able to compare this research output to 10 others from the same source and published within six weeks on either side of this one. This one has scored higher than 7 of them.