Bonding mechanism of electroless Ni-P film with AlN substrate and Cu foil
Overview of attention for article published in IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, June 1998
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Among the highest-scoring outputs from this source (#19 of 158)
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Above-average Attention Score compared to outputs of the same age (61st percentile)
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Average Attention Score compared to outputs of the same age and source
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