Effect of film thickness on the evolution of annealing texture in sputtered copper films

Overview of attention for article published in Journal of Electronic Materials, December 2005

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Semiconductor devices with copper interconnects and methods for fabricating same

Grant US-9190323-B2

United States of America

SEMICONDUCTOR DEVICES WITH COPPER INTERCONNECTS AND METHODS FOR FABRICATING SAME

Application US-20130187273-A1

United States of America

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