Deposition of plasma-polymerized acetylene by an intense pulsed RF plasma source

Overview of attention for article published in IEEE Transactions on Plasma Science, January 1990

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Low shrinkage dielectric films

Grant US-9018108-B2

United States of America

28 Apr 2015

Method to increase tensile stress of silicon nitride films using a post PECVD deposition…

Grant US-8753989-B2

United States of America

17 Jun 2014

Method to increase silicon nitride tensile stress using nitrogen plasma in-situ treatment…

Grant US-8138104-B2

United States of America

20 Mar 2012

Method to increase tensile stress of silicon nitride films using a post PECVD deposition…

Grant US-8129290-B2

United States of America

06 Mar 2012

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