Plasma-parameter dependence of thin-oxide damage from wafer charging during electron-cyclotron-resonance plasma processing

Overview of attention for article published in IEEE Transactions on Semiconductor Manufacturing, January 1997

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Micromachined probe apparatus and methods for making and using same to characterize…

Grant US-7116115-B2

United States of America

Method of monitoring radiation using a floating gate field effect transistor dosimeter…

Grant US-6172368-B1

United States of America

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