Localized induction heating solder bonding for wafer level MEMS packaging

Overview of attention for article published in Journal of Micromechanics & Microengineering, December 2004

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Good Attention Score compared to outputs of the same age (74th percentile)
Above-average Attention Score compared to outputs of the same age and source (53rd percentile)

Mentioned by

patent: 6 patents

Readers on

mendeley: 40 Mendeley

So far, Altmetric has seen 6 patents that reference this research output.

Compression and cold weld sealing method for an electrical via connection

Grant US-9796583-B2

United States of America

24 Oct 2017

Reactive bonding of a flip chip package

Grant US-8987130-B2

United States of America

24 Mar 2015

Hermetically sealing using a cold welded tongue and groove structure

Grant US-8191756-B2

United States of America

05 Jun 2012

Semiconductor device and method for manufacturing semiconductor device

Grant US-7633150-B2

United States of America

15 Dec 2009

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