Robust design and manufacturing of ceramic laminates with controlled thermal residual stresses for enhanced toughness

Overview of attention for article published in Journal of Materials Science, October 2005

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Laminated interposers and packages with embedded trace interconnects

Grant US-10636780-B2

United States of America

Interconnection substrates for interconnection between circuit modules, and methods of…

Grant US-10586759-B2

United States of America

Embedded vialess bridges

Grant US-10347582-B2

United States of America

Laminated interposers and packages with embedded trace interconnects

Grant US-10283492-B2

United States of America

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