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3-D Structure Design and Reliability Analysisof Wafer Level Package with Stress Buffer Mechanism

Overview of attention for article published in IEEE Transactions on Components and Packaging Technologies, March 2007
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About this Attention Score

  • Among the highest-scoring outputs from this source (#16 of 290)
  • Good Attention Score compared to outputs of the same age (68th percentile)
  • Good Attention Score compared to outputs of the same age and source (66th percentile)

Mentioned by

patent
2 patents

Readers on

mendeley
6 Mendeley
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Article details
Title
3-D Structure Design and Reliability Analysisof Wafer Level Package with Stress Buffer Mechanism
Published in
IEEE Transactions on Components and Packaging Technologies, March 2007
DOI 10.1109/tcapt.2007.892083
Authors

Chang-Chun Lee, Hsing-Chih Liu, Kuo-Ning Chiang

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Timeline Attention over time Attention Score history
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Mendeley demographics

Mendeley demographics

The data shown below were compiled from readership statistics for 6 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Geographical breakdown
Country Count As %
Unknown 6 100%

Demographic breakdown

Readers by professional status
Readers by professional status Count As %
Professor 3 50%
Student > Master 2 33%
Researcher 1 17%
Readers by discipline
Readers by discipline Count As %
Engineering 4 67%
Business, Management and Accounting 1 17%
Agricultural and Biological Sciences 1 17%
Attention Score in Context

Attention Score in Context

This research output has an Altmetric Attention Score of 6. This is our high-level measure of the quality and quantity of online attention that it has received. This Attention Score, as well as the ranking and number of research outputs shown below, was calculated when the research output was last mentioned on 14 July 2015.
All research outputs
#6,533,249
of 30,096,795 outputs
Outputs from IEEE Transactions on Components and Packaging Technologies
#16
of 290 outputs
Outputs of similar age
#22,289
of 106,405 outputs
Outputs of similar age from IEEE Transactions on Components and Packaging Technologies
#1
of 9 outputs
Altmetric has tracked 30,096,795 research outputs across all sources so far. This one has received more attention than most of these and is in the 74th percentile.
So far Altmetric has tracked 290 research outputs from this source. They receive a mean Attention Score of 3.7. This one has done well, scoring higher than 84% of its peers.
Older research outputs will score higher simply because they've had more time to accumulate mentions. To account for age we can compare this Altmetric Attention Score to the 106,405 tracked outputs that were published within six weeks on either side of this one in any source. This one has gotten more attention than average, scoring higher than 68% of its contemporaries.
We're also able to compare this research output to 9 others from the same source and published within six weeks on either side of this one. This one has scored higher than all of them