3-D Structure Design and Reliability Analysisof Wafer Level Package with Stress Buffer Mechanism
Overview of attention for article published in IEEE Transactions on Components and Packaging Technologies, March 2007
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About this Attention Score
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Among the highest-scoring outputs from this source (#16 of 290)
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Good Attention Score compared to outputs of the same age (68th percentile)
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Good Attention Score compared to outputs of the same age and source (66th percentile)
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