Hybrid data mining approach for pattern extraction from wafer bin map to improve yield in semiconductor manufacturing

Overview of attention for article published in International Journal of Production Economics, May 2007

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So far, Altmetric has seen 7 patents that reference this research output.

Wafer map identification method and computer-readable recording medium

Grant US-11132790-B2

United States of America

28 Sep 2021

Integrated circuit chip reliability qualification using a sample-specific expected fail…

Grant US-10539611-B2

United States of America

21 Jan 2020

Integrated circuit chip reliability qualification using a sample-specific expected fail…

Grant US-9891275-B2

United States of America

13 Feb 2018

Integrated circuit chip reliability using reliability-optimized failure mechanism…

Grant US-9639645-B2

United States of America

02 May 2017

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