A 3 Megapixel 100 Fps 2.8 $\mu$m Pixel Pitch CMOS Image Sensor Layer with Built-in Self-Test for 3D Integrated Imagers

Overview of attention for article published in IEEE Journal of Solid-State Circuits, January 2013

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Methods and apparatus for signal distribution in an image sensor

Grant US-10692179-B2

United States of America

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