The Design of Cold Plates for the Thermal Management of Electronic Equipment

Overview of attention for article published in Heat Transfer Engineering, February 2007

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Among the highest-scoring outputs from this source (#14 of 124)

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patent: 7 patents

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mendeley: 38 Mendeley

So far, Altmetric has seen 7 patents that reference this research output.

Thermal management of three-dimensional integrated circuits

Grant US-12582010-B2

United States of America

17 Mar 2026

Thermal management of three-dimensional integrated circuits

Grant US-12327820-B2

United States of America

10 Jun 2025

Thermal management of three-dimensional integrated circuits

Grant US-11942453-B2

United States of America

26 Mar 2024

Thermal management of three-dimensional integrated circuits

Grant US-11710723-B2

United States of America

25 Jul 2023

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