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Testing of Interposer-Based 2.5D Integrated Circuits

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Attention for Chapter 3: Post-bond Scan-Based Testing of Interposer Interconnects
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Chapter title
Post-bond Scan-Based Testing of Interposer Interconnects
Chapter number 3
Book title
Testing of Interposer-Based 2.5D Integrated Circuits
Published by
Springer, Cham, January 2017
DOI 10.1007/978-3-319-54714-5_3
Book ISBNs
978-3-31-954713-8, 978-3-31-954714-5
Authors

Ran Wang, Krishnendu Chakrabarty