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Micro-Manufacturing Technologies and Their Applications

Overview of attention for book
Attention for Chapter 7: Moulded Interconnect Devices
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Citations

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10 Mendeley
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Chapter title
Moulded Interconnect Devices
Chapter number 7
Book title
Micro-Manufacturing Technologies and Their Applications
Published by
Springer, Cham, January 2017
DOI 10.1007/978-3-319-39651-4_7
Book ISBNs
978-3-31-939650-7, 978-3-31-939651-4
Authors

Adrien Brunet, Ulrich Gengenbach, Tobias Müller, Steffen Scholz, Markus Dickerhof, Brunet, Adrien, Gengenbach, Ulrich, Müller, Tobias, Scholz, Steffen, Dickerhof, Markus

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 10 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 10 100%

Demographic breakdown

Readers by professional status Count As %
Researcher 4 40%
Lecturer 2 20%
Student > Ph. D. Student 2 20%
Student > Bachelor 1 10%
Professor > Associate Professor 1 10%
Other 0 0%
Readers by discipline Count As %
Engineering 7 70%
Materials Science 2 20%
Unknown 1 10%