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Three-Dimensional Integration of Semiconductors

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Attention for Chapter 7: TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability
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Chapter title
TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability
Chapter number 7
Book title
Three-Dimensional Integration of Semiconductors
Published by
Springer, Cham, January 2015
DOI 10.1007/978-3-319-18675-7_7
Book ISBNs
978-3-31-918674-0, 978-3-31-918675-7
Authors

Kangwook Lee, Mitsuma Koyanagi