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| Chapter title |
TSV Processes
|
|---|---|
| Chapter number | 3 |
| Book title |
Three-Dimensional Integration of Semiconductors
|
| Published by |
Springer, Cham, January 2015
|
| DOI | 10.1007/978-3-319-18675-7_3 |
| Book ISBNs |
978-3-31-918674-0, 978-3-31-918675-7
|
| Authors |
Masahiko Tanaka, Makoto Sekine, Itsuko Sakai, Yutaka Kusuda, Tomoyuki Nonaka, Osamu Tsuji, Kazuo Kondo |