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Three-Dimensional Integration of Semiconductors

Overview of attention for book
Attention for Chapter 3: TSV Processes
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Chapter title
TSV Processes
Chapter number 3
Book title
Three-Dimensional Integration of Semiconductors
Published by
Springer, Cham, January 2015
DOI 10.1007/978-3-319-18675-7_3
Book ISBNs
978-3-31-918674-0, 978-3-31-918675-7

Masahiko Tanaka, Makoto Sekine, Itsuko Sakai, Yutaka Kusuda, Tomoyuki Nonaka, Osamu Tsuji, Kazuo Kondo

Mendeley readers

The data shown below were compiled from readership statistics for 1 Mendeley reader of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 1 100%

Demographic breakdown

Readers by professional status Count As %
Unknown 1 100%
Readers by discipline Count As %
Unknown 1 100%