A DfT Technique for Electrical Interconnect Testing of Circuit Boards with 3D Stacked SRAM ICs
Conference proceeding (November 2023)
The most recent citing publications are shown below. View all 9 publications that cite this research output on Dimensions.
Conference proceeding (November 2023)
Article in Journal of The Japan Institute of Electronics Packaging (November 2023)
Article in ACM Transactions on Architecture and Code Optimization (July 2021)