Carbon nanotube bumps for the flip chip packaging system

Overview of attention for article published in Discover Nano, February 2012

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patent: 1 patent

Citations

dimensions_citation: 30 Dimensions

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mendeley: 22 Mendeley

Summary Patents Dimensions citations

So far, Dimensions has found 30 publications that cite this research output.

30

The most recent citing publications are shown below. View all 30 publications that cite this research output on Dimensions.

Thermomechanical Reliability Investigation of Carbon Nanotube Off-Chip Interconnects for Electronic Packages

Article in IEEE Transactions on Components Packaging and Manufacturing Technology (July 2022)

Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration

Article in Journal of Electronic Packaging (November 2021)

Semiconductor Chip Electrical Interconnection and Bonding by Nano-Locking with Ultra-Fine Bond-Line Thickness

Article in Nanomaterials (July 2021)

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