Development of high-temperature solders: Review

Overview of attention for article published in Microelectronics Reliability, July 2012

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patent: 3 patents

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dimensions_citation: 249 Dimensions

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mendeley: 155 Mendeley
citeulike: 1 CiteULike

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So far, Altmetric has seen 3 patents that reference this research output.

Lead frame construct for lead-free solder connections

Grant US-9520347-B2

United States of America

Thermoelectric module and method of fabricating the same

Grant US-8921679-B2

United States of America

THERMOELECTRIC MODULE AND METHOD OF FABRICATING THE SAME

Application US-20130167896-A1

United States of America

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