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Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures

Overview of attention for article published in Journal of Electronic Materials, September 2012
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About this Attention Score

  • Average Attention Score compared to outputs of the same age

Mentioned by

patent
1 patent

Citations

dimensions_citation
30 Dimensions

Readers on

mendeley
30 Mendeley
Summary Patents Dimensions citations
So far, Dimensions has found 30 publications that cite this research output.

30

The most recent citing publications are shown below. View all 30 publications that cite this research output on Dimensions.

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