Study on morphology and interface relationship between Ag3(Sn, In) and Cu6(Sn, In)5
Article in Materials Chemistry and Physics (March 2023)
The most recent citing publications are shown below. View all 9 publications that cite this research output on Dimensions.
Effect of different IMCs on the crystal orientation of IMCs/solder joint/Cu
Article in Journal of Materials Science: Materials in Electronics (January 2023)
Study on interfacial reaction behavior of SnAg based lead-free solder with (111) single crystal copper substrate
Article in Microelectronics Reliability (December 2022)