Surface activation using remote plasma for silicon to quartz wafer bonding

Overview of attention for article published in Microsystem Technologies, October 2008

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In the top 25% of all research outputs scored by Altmetric
Among the highest-scoring outputs from this source (#43 of 596)
Good Attention Score compared to outputs of the same age (71st percentile)
Above-average Attention Score compared to outputs of the same age and source (60th percentile)

Mentioned by

patent: 2 patents

wikipedia: 1 Wikipedia page

Citations

dimensions_citation: 7 Dimensions

Readers on

mendeley: 27 Mendeley

Summary Patents Wikipedia Dimensions citations

So far, Dimensions has found 7 publications that cite this research output.

7

The most recent citing publications are shown below. View all 7 publications that cite this research output on Dimensions.

Direct Homo/Heterogeneous Bonding of Silicon and Glass Using Vacuum Ultraviolet Irradiation in Air

Article in Journal of The Electrochemical Society (January 2018)

Low-temperature wafer direct bonding of silicon and quartz glass by a two-step wet chemical surface cleaning

Article in Japanese Journal of Applied Physics (November 2017)

Room-temperature direct bonding of silicon and quartz glass wafers

Article in Applied Physics Letters (May 2017)

This page shows the most recent citations of this research output.

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