Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

Overview of attention for article published in Journal of Electronic Materials, September 2007

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So far, Altmetric has seen 4 patents that reference this research output.

Bonding structure and method of manufacturing bonding structure

Grant US-11702725-B2

United States of America

Apparatus and manufacturing method

Grant US-10784181-B2

United States of America

Pre-sintered semiconductor die structure

Grant US-8835299-B2

United States of America

Pre-Sintered Semiconductor Die Structure

Application US-20140061909-A1

United States of America

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