Fracture behavior of Cu-cored solder joints

Overview of attention for article published in Journal of Materials Science, June 2011

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patent: 2 patents

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dimensions_citation: 23 Dimensions

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mendeley: 6 Mendeley

Summary Patents Dimensions citations

So far, Dimensions has found 23 publications that cite this research output.

23

The most recent citing publications are shown below. View all 23 publications that cite this research output on Dimensions.

Effect of thickness in the SAC 305 plated layer on the interfacial reaction and mechanical properties of the CCSB joint assembled onto the OSP surface finished FR-4 PCB board

Article in Journal of Materials Science: Materials in Electronics (February 2024)

Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing

Article in Journal of Electronic Materials (December 2023)

Collapse behavior and interfacial reaction of Cu-cored solder balls experienced multiple reflows

Conference proceeding (August 2023)

This page shows the most recent citations of this research output.

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