Multilayer component for the encapsulation of a sensitive element Grant US-10036832-B2 United States of America 31 Jul 2018
Paper or paperboard substrate, a process for production of the substrate and a package… Grant US-9994999-B2 United States of America 12 Jun 2018
Layered element for encapsulating a senstive element Grant US-9246131-B2 United States of America 26 Jan 2016
MULTILAYER COMPONENT FOR THE ENCAPSULATION OF A SENSITIVE ELEMENT Application EP-2695218-A4 European Patent Office 12 Nov 2014