Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminum Metallization

Overview of attention for article published in Journal of Electronic Materials, September 2009

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So far, Altmetric has seen 3 patents that reference this research output.

Power overlay structure and reconstituted semiconductor wafer having wirebonds

Application US-10204881-B2

United States of America

Power overlay structure having wirebonds and method of manufacturing same

Grant US-9613843-B2

United States of America

Encapsulant with corrosion inhibitor

Grant US-9117756-B2

United States of America

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