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Fatigue Life Prediction of Die-Attach Joint in Power Semiconductors Subjected to Biaxial Stress by High-Speed Thermal Cycling

Overview of attention for article published in Materials Transactions, May 2022
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Title
Fatigue Life Prediction of Die-Attach Joint in Power Semiconductors Subjected to Biaxial Stress by High-Speed Thermal Cycling
Published in
Materials Transactions, May 2022
DOI 10.2320/matertrans.mt-mc2022006
Authors

Hiroki Kanai, Yoshiharu Kariya, Hiroshige Sugimoto, Yoshiki Abe, Yoshinori Yokoyama, Koki Ochi, Ryuichiro Hanada, Shinnosuke Soda

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Mendeley readers

The data shown below were compiled from readership statistics for 4 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 4 100%

Demographic breakdown

Readers by professional status Count As %
Researcher 1 25%
Unknown 3 75%
Readers by discipline Count As %
Engineering 1 25%
Unknown 3 75%